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● Headquarters-Taiwan
Contact:Mrs. Shen
TEL : +886-3-318-5300#318
FAX : +886-3-328-2290
E-Mail : sales@ckplas.com


● Subsidiary-China
Contact:Mrs. Li
TEL:+86-512-83667689/90
FAX:+86-512-83667691
E-Mail : sales@ckplas.com.cn

 

| FOUP CKH300 13slot (300mm / 12 inch) for thin wafer

 
CK300 FOUP
Products Specification
● Product name:CKH300 FOUP
● Dimension:440(L) x 347(W) x 337(H)mm
● Capacity:13 PCS
● Wafer size:300mm(12 inch)Thin Wafer
● Material:Customized
● Slot pitch:20 mm
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Products Description

300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.

CKplas H300/H313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, CK300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

FOUP CK300 - front
FOUP CK300 - front

晶圓傳輸盒FOUP CK300 - back

FOUP Door KeyFOUP Door Key

FOUP
前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK313 前開式晶圓傳送盒CK300
FOUP CKH313
13 slot
FOUP CKH313
13 slot Back Support
FOUP CKH300
25 slot
Ckplas could customize the product depends on customer’s requirements on different manufacturing process.
Wafer Type Standard Version Wafer Thin Wafer 
Process Type General Process Low Moisture Absorption Material General Process 
Model H300-S1 H300-L1 H313-S1 H313-S2
Capacity 25 slot 25 slot 13 slot 13 slot
Weight     5.6kg 6.2kg
Main Material PC ESD CBM ESD PC ESD PC ESD
Rear Window See Through Window Black Window See Through Window Black Window With Back Support
Temperature Tolerance ≦ 80°C ≦ 80°C
Inflatable Raft Distance 160x250mm 160x250mm 
RUN CARD v v v v
RFID v v v v

Wafer Type Thin Wafer   
Process Type General Process Low Moisture Absorption Material High Temperature Process
Model H313-S3 H313-L1 H313-L2 CK313HT
Capacity 13 slot 13 slot 13 slot 13 slot
Weight 6kg 5kg 6kg 6.6kg
Main Material PC ESD CBM ESD CBM ESD PEI ESD
Rear Window See Through  Window With Back Support Black Window Black Window With Back Support ESD Removable
Airtight Black Window
Temperature Tolerance ≦ 60°C ≦ 80°C ≦ 80°C ≦ 150°C
Inflatable Raft Distance 160x250mm   160x260mm
RUN CARD v v v x
RFID v v v x
Product Feature
Heat resistant FOUP & Movable Window Heat resistant FOUP & Movable Window
Heat resistant FOUP & ESD Removable Airtight Black Window
Patent No.:
Taiwanese Patent No.:I586597、M563421 、M528296、M588109
Chinese Patent No.:CN204348693U、CN205609490U、 CN206259327U、CN208007736U、CN210654281U 、CN210654281U
Korea Patent No.:20-0486265
Customized
晶圓傳輸盒 晶圓傳輸盒
● Able to install RFID & Run Card

● Black Window With Back Support

Related Products
FOUP CK300
 
FOUP Door key
 
FOUP CK300
 
Wafer SMIF Pod
12" 25 slot FOUP   FOUP Door key   12" 13 slot FOUP (Back Support)   8" Wafer SMIF Pod
 
 
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