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Semiconductor Wafer Carrier / Wafer Size
● 150mm
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● Headquarters-Taiwan
Contact:Mrs. Li
TEL : +886-3-318-5300#202
FAX : +886-3-328-2290
E-Mail : sales@ckplas.com


● Locatings-China
Contact:Mrs. Li
TEL:+86-512-83667689/90
FAX:+86-512-83667691
E-Mail : sales@ckplas.com.cn

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| 8" Wafer Expander Rings / Double ring / Die Grip ring

 
Wafer Expander Rings
Products Specification
● Product name:8" Wafer Expander Rings
● Part number:EX-R200
● Dimension:
Inner ring- Ø206.11(O.D.) x 194.5(I.D.) x 5.8(H)mm
Outer ring-Ø210.31(O.D.) x 202.35(I.D.) x 5.7(H)mm
● Weight:40g
● Apply for round wafer:6 inch (Ø150mm)
● Material:Resin
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Products Description
Grip Ring can be used in semiconductor and LED chip, consisted of inner and outer ring. Grip Ring able to fix wafer to let it expand, provide variety of specs for customer to choose.
不同尺寸晶圓擴張環可供選擇,亦提供Customized Hoop Ring Shipper搭配晶圓擴張環的專屬外盒
Wafer size:6inch、7inch、8inch Hoop Ring Shipper
Product Feature

Product would be more stable and accurate after test such as surface resistance, pulling and bending. High quality Grip Ring can largely reduce costs by pick up speed of grain picking during manufacturing and then reduce process time and NG products.

Customized
Special size of Grip Ring can be customized by customers’ request.
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