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We are pleased to inform you that we will be exhibiting at SEMICON Taiwan 2026, taking place from September 2 to September 4, 2026 at the Taipei Nangang Exhibition Center, Hall 1.
At the event, we will showcase our latest 3D IC advanced packaging solutions along with a variety of wafer handling carriers, supporting the semiconductor industry’s progress toward the AI era.
We sincerely invite you to visit our booth and explore future technologies together with us.
Date: September 2–4, 2026
Venue: TaiNEX1 1F
Booth: I2726

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