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We are pleased to announce our participation in SEMICON Japan 2025, taking place from December 17 to December 19, 2025 at Tokyo Big Sight. We will be showcasing our latest 3D IC advanced packaging solutions and a wide range of wafer handling carriers, supporting the semiconductor industry as it moves into the new AI era.
We sincerely invite you to visit our booth and explore cutting-edge technologies together as we create a smarter future.
Event Dates: December 17–19, 2025
Venue: Tokyo Big Sight
Booth: E5213

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